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Journal Article
Interconnection Technology Based on InSn Solder for Flexible Display Applications
- Authors
- Kwang-Seong Choi, Haksun Lee, Hyun-Cheol Bae, Yong-Sung Eom, Jin Ho Lee
- Issue Date
- 2015-04
- Citation
- ETRI Journal, v.37, no.2, pp.387-394
- ISSN
- 1225-6463
- Publisher
- 한국전자통신연구원 (ETRI)
- Language
- English
- Type
- Journal Article
- Abstract
- A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than 150°C. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than 150°C. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a 20 um pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at 130°C.
- KSP Keywords
- Bonding process, Contact resistance(73.40.Cg), Display applications, Electrical contact resistance, Flip-chip bonding, Glass substrate, InSn solder, Process temperature, Screen printing process, Solder bump, flexible display