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Journal Article
Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste
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- Authors
- Yong-Sung Eom, Ji-Hye Son, Hak-Sun Lee, Kwang-Seong Choi, Hyun-Cheol Bae, Jeong-Yeol Choi, Tae-Sung Oh, Jong-Tae Moon
- Issue Date
- 2015-01
- Citation
- 한국마이크로전자 및 패키징학회지, v.22, no.1, pp.51-54
- ISSN
- 1226-9360
- Publisher
- 한국마이크로전자 및 패키징학회지
- Language
- English
- Type
- Journal Article
- KSP Keywords
- Conductive pattern, Electro-plating, Plating technology, copper paste, screen-printed