상세정보
학술지
Photolithography-Based Patterning of Liquid Metal Interconnects for Monolithically Integrated Stretchable Circuits
- 발행일
- 201606
- 출처
- ACS Applied Materials & Interfaces, v.8 no.24, pp.15459-15465
- ISSN
- 1944-8244
- 출판사
- American Chemical Society(ACS)
- 협약과제
- 16MB1100, 미래광고 서비스를 위한 에너지절감형 환경적응 I/O (Input/Output) 플랫폼 기술 개발, 황치선
- 초록
- We demonstrate a new patterning technique for gallium-based liquid metals on flat substrates, which can provide both high pattern resolution (~20 μm) and alignment precision as required for highly integrated circuits. In a very similar manner as in the patterning of solid metal films by photolithography and lift-off processes, the liquid metal layer painted over the whole substrate area can be selectively removed by dissolving the underlying photoresist layer, leaving behind robust liquid patterns as defined by the photolithography. This quick and simple method makes it possible to integrate fine-scale interconnects with preformed devices precisely, which is indispensable for realizing monolithically integrated stretchable circuits. As a way for constructing stretchable integrated circuits, we propose a hybrid configuration composed of rigid device regions and liquid interconnects, which is constructed on a rigid substrate first but highly stretchable after being transferred onto an elastomeric substrate. This new method can be useful in various applications requiring both high-resolution and precisely aligned patterning of gallium-based liquid metals.
- KSP 제안 키워드
- Alignment precision, High-resolution, Liquid metal, Metal interconnects, Patterning technique, Rigid substrate, elastomeric substrate, highly integrated circuits, highly stretchable, lift-off, metal films