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학술대회
Multi-layer Substrate Based Power Semiconductor Package for Low Parasitic Inductance and High Heat Transfer
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- 발행일
- 201607
- 출처
- Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD) 2016, pp.283-285
- 협약과제
- 15MB8200, 차세대 고효율 3D 융합 전력변환모듈, 고상춘
- KSP 제안 키워드
- Heat Transfer, Low parasitic inductance, Multi-layer substrate, Power semiconductor, Semiconductor package