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Conference Paper Multi-layer Substrate Based Power Semiconductor Package for Low Parasitic Inductance and High Heat Transfer

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Authors: Dong Yun Jung, Chi Hoon Jun, Hyun-gyu Jang, Ki Hwan Kim, Junbo Park, Minki Kim, Hyun Soo Lee, Sang Choon Ko, Eun Soo Nam

Issue Date: 2016-07

Citation: Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD) 2016, pp.283-285

Language: English

Type: Conference Paper

KSP Keywords: Heat transfer, Low parasitic inductance, Multi-layer substrate, Power semiconductor, Semiconductor package

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