상세정보
학술지
High-Performance Metal-Substrate Power Module for Electrical Applications
- 발행일
- 201608
- 출처
- ETRI Journal, v.38 no.4, pp.645-653
- ISSN
- 1225-6463
- 출판사
- 한국전자통신연구원 (ETRI)
- 협약과제
- 16MB2100, 웨어러블 디바이스용 Form factor-free 다중입출력 전원모듈 기술 개발, 양일석
- 초록
- This paper demonstrates the performance of a metalsubstrate power module with multiple fabricated chips for a high current electrical application, and evaluates the proposed module using a 1.5-kW sinusoidal brushless direct current (BLDC) motor. Specifically, the power module has a hybrid structure employing a single-layer heat-sink extensible metal board (Al board). A fabricated motor driver IC and trench gate DMOSFET (TDMOSFET) are implemented on the Al board, and the proper heat-sink size was designed under the operating conditions. The fabricated motor driver IC mainly operates as a speed controller under various load conditions, and as a multi-phase gate driver using an N-ch silicon MOSFET high-side drive scheme. A fabricated power TDMOSFET is also included in the fabricated power module for three-phase inverter operation. Using this proposed module, a BLDC motor is operated and evaluated under various pulse load tests, and our module is compared with a commercial MOSFET module in terms of the system efficiency and input current.
- KSP 제안 키워드
- Brushless direct current (BLDC) motor, Direct current(DC), Heat sink, High current, High performance, Hybrid structure, Load conditions, Load tests, Motor driver, Operating conditions, Phase gate