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Journal Article Hydrazine (N2H4)-Based Surface Treatment for Interface Quality Improvement in Al2O3/AlGaN/GaN MIS-HEMT
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Authors
Hyun-Wook Jung, Min Jeong Shin, Sung-Jae Chang, Ho-Kyun Ahn, Jae-Won Do, Kyu Jun Cho, Chul-Ho Won, Byoung-Gue Min, Haecheon Kim, Hyung Sup Yoon, Jung-Hee Lee, Jong-Won Lim
Issue Date
2017-03
Citation
ECS Journal of Solid State Science and Technology, v.6, no.4, pp.184-186
ISSN
2162-8769
Publisher
Electrochemical Society (ECS)
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1149/2.0331704jss
Abstract
This paper highlights N2H4 treatment on AlGaN surface prior to Al2O3 deposition for insulator/III-nitride interface quality improvement. AlGaN surface with and without N2H4 treatment was systematically analyzed through X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM), which show an effective removal of the native oxide and improved roughness on AlGaN surface. In order to investigate the effects of N2H4 treatment on the electrical properties of Al2O3/AlGaN/GaN MIS-HEMT, capacitance-voltage (C(V)) characteristics and transfer characteristics after gate bias stress were measured. Compared to the devices without N2H4 treatment featuring a large hysteresis of 0.3 V and a high subthreshold slope (SS) = 119 mV/dec, N2H4-treated devices exhibit an almost negligible hysteresis of 50 mV and an improved SS of 105 mV/dec.
KSP Keywords
3 V, AlGaN/GaN MISHEMTs, Atomic force microscope(AFM), Atomic force microscopy (afm), Capacitance-voltage, Gate bias stress, III-Nitrides, Native oxide, Quality improvement, Subthreshold slope(SS), Surface treatments