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Journal Article
A Single‐Chamber System of Initiated Chemical Vapor Deposition and Atomic Layer Deposition for Fabrication of Organic/Inorganic Multilayer Films
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- Authors
- Bong Jun Kim, Hongkeun Park, Hyejeong Seong, Min Seok Lee, Byoung-Hwa Kwon, Do Heung Kim, Young Il Lee, Hyunkoo Lee, Jeong-Ik Lee, Sung Gap Im
- Issue Date
- 2017-06
- Citation
- Advanced Engineering Materials, v.19, no.6, pp.1-9
- ISSN
- 1438-1656
- Publisher
- John Wiley & Sons
- Language
- English
- Type
- Journal Article
- Abstract
- A single-chamber system capable of depositing both organic and inorganic layers by initiated chemical vapor deposition (iCVD) and atomic layer deposition (ALD) is demonstrated to facilitate the fabrication of organic/inorganic hybrid thin film encapsulation (TFE). The chamber geometry and the process conditions of iCVD and ALD are similar to each other, which enabled the design of the single-chamber system. Both organic and inorganic films deposited via the single-chamber system produces films with their properties equivalent to those deposited in separate iCVD and ALD reactors. Alternating the deposition mode between iCVD and ALD produces organic/inorganic multilayers with outstanding barrier properties as well as optical transparency mechanical flexibility.
- KSP Keywords
- Atomic Layer Deposition, Barrier properties, Deposition mode, Hybrid thin film, Initiated Chemical Vapor Deposition, Inorganic films, Mechanical flexibility, Organic/inorganic multilayer, Process conditions, Single chamber, Thin film encapsulation