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Journal Article
Cost-effective Parallel Optical Interconnection Module Based on Fully Passive-alignment Process
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- Issue Date
- 2017-11
- Citation
- Optical Engineering, v.56, no.11, pp.1-4
- ISSN
- 0091-3286
- Publisher
- SPIE
- Language
- English
- Type
- Journal Article
- Abstract
- In optical interconnection technology, high-speed and large data transitions with low error rate and cost reduction are key issues for the upcoming 8K media era. The researchers present notable types of optical manufacturing structures of a four-channel parallel optical module by fully passive alignment, which are able to reduce manufacturing time and cost. Each of the components, such as vertical-cavity surface laser/positive-intrinsic negative-photodiode array, microlens array, fiber array, and receiver (RX)/transmitter (TX) integrated circuit, is integrated successfully using flip-chip bonding, die bonding, and passive alignment with a microscope. Clear eye diagrams are obtained by 25.78-Gb/s (for TX) and 25.7-Gb/s (for RX) nonreturn-to-zero signals of pseudorandom binary sequence with a pattern length of 231 to 1. The measured responsivity and minimum sensitivity of the RX are about 0.5 A/W and ?돞-6.5 dBm at a bit error rate (BER) of 10-12, respectively. The optical power margin at a BER of 10-12 is 7.5 dB, and cross talk by the adjacent channel is ?돞1 dB.
- KSP Keywords
- Adjacent channel, Bit Error Rate(And BER), Die bonding, Eye Diagram, Fiber arrays, Flip-chip bonding, Four-Channel, High Speed, Integrated circuit, Key Issues, Microlens array