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학술지 Cost-effective Parallel Optical Interconnection Module Based on Fully Passive-alignment Process
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저자
손동훈, 허영순, 박형준, 강현서, 김성창
발행일
201711
출처
Optical Engineering, v.56 no.11, pp.1-4
ISSN
0091-3286
출판사
SPIE
DOI
https://dx.doi.org/10.1117/1.OE.56.11.110503
협약과제
17ZK1100, 지역산업연계 ICT 융합기술 산업화 지원 사업, 강현서
초록
In optical interconnection technology, high-speed and large data transitions with low error rate and cost reduction are key issues for the upcoming 8K media era. The researchers present notable types of optical manufacturing structures of a four-channel parallel optical module by fully passive alignment, which are able to reduce manufacturing time and cost. Each of the components, such as vertical-cavity surface laser/positive-intrinsic negative-photodiode array, microlens array, fiber array, and receiver (RX)/transmitter (TX) integrated circuit, is integrated successfully using flip-chip bonding, die bonding, and passive alignment with a microscope. Clear eye diagrams are obtained by 25.78-Gb/s (for TX) and 25.7-Gb/s (for RX) nonreturn-to-zero signals of pseudorandom binary sequence with a pattern length of 231 to 1. The measured responsivity and minimum sensitivity of the RX are about 0.5 A/W and ?돞-6.5 dBm at a bit error rate (BER) of 10-12, respectively. The optical power margin at a BER of 10-12 is 7.5 dB, and cross talk by the adjacent channel is ?돞1 dB.
KSP 제안 키워드
Adjacent channel, Bit Error Rate(And BER), Cross Talk, Die bonding, Eye Diagram, Flip-chip bonding, Four-Channel, High Speed, Integrated circuit, Key Issues, Microlens array