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Conference Paper
3D SiP Module using TSV and Novel Solder Bump Maker
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- Authors
- Hyun-Cheol Bae, Kwang-Seong Choi, Yong-Sung Eom, Byeong-Ok Lim, Ki-Jun Sung, Sung Hae Jung, Byeung-Gee Kim, In-Soo Kang, Jong-Tae Moon
- Issue Date
- 2010-06
- Citation
- Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641
- Publisher
- IEEE
- Language
- English
- Type
- Conference Paper
- Abstract
- In this paper, a 3D system in package (SiP) module using through silicon vias (TSV) and novel solder bump maker (SBM) has been presented. The SBM is a paste material which is composed of the solder powder and polymer resin. The polymer resin had the smart properties to eliminate the oxide layers on the solder powder and electrode and to form the solder bumps on the electrodes using the rheological behavior of the droplets without any aligning methods. The five chips with TSVs were stacked on a Si interposer with the three redistribution layers (RDL) using the solder bumps formed by SBM and a fluxless underfill material. © 2010 IEEE.
- KSP Keywords
- 3D SiP, 3D system, Oxide layer, Polymer resin, Redistribution layer, Rheological Behavior, Si interposer, Smart properties, Solder bump, System in package(SIP), Through silicon vias(TSV)