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Journal Article Flexible Integrated OLED Substrates Prepared by Printing and Plating Process
Cited 49 time in scopus Share share facebook twitter linkedin kakaostory
Authors
Doo-Hee Cho, O Eun Kwon, Young-Sam Park, Byoung Gon Yu, Jonghee Lee, Jaehyun Moon, Hyunsu Cho, Hyunkoo Lee, Nam Sung Cho
Issue Date
2017-11
Citation
Organic Electronics, v.50, pp.170-176
ISSN
1566-1199
Publisher
Elsevier
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1016/j.orgel.2017.07.041
Abstract
We developed a cost-effective process to fabricate a flexible integrated organic light-emitting diode (OLED) substrate using a screen printing, an electroless copper plating, and a delamination process. Photolithographic method and expensive material such as silver paste were not used. Green OLED devices with the flexible integrated substrates were successfully fabricated, and the electro-optical characteristics such as leakage current and external quantum efficiency of the flexible OLED devices were comparable to those of OLED devices with a glass substrate. The process of this study is suitable for the low cost production of flexible OLED lighting panels.
KSP Keywords
Electro-Optical, External Quantum Efficiency, Flexible oled, Glass substrate, Leakage current, Low-cost, OLED devices, OLED lighting, Optical characteristics, Organic light-emitting diodes(OLEDS), Silver Paste