상세정보
학술지
Flexible Integrated OLED Substrates Prepared by Printing and Plating Process
- 발행일
- 201711
- 출처
- Organic Electronics, v.50, pp.170-176
- ISSN
- 1566-1199
- 출판사
- Elsevier
- 협약과제
- 17ZB1900, 초저가 플렉서블 Lighting Surface 기술 개발, 유병곤
- 초록
- We developed a cost-effective process to fabricate a flexible integrated organic light-emitting diode (OLED) substrate using a screen printing, an electroless copper plating, and a delamination process. Photolithographic method and expensive material such as silver paste were not used. Green OLED devices with the flexible integrated substrates were successfully fabricated, and the electro-optical characteristics such as leakage current and external quantum efficiency of the flexible OLED devices were comparable to those of OLED devices with a glass substrate. The process of this study is suitable for the low cost production of flexible OLED lighting panels.