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Journal Article Flexible Integrated OLED Substrates Prepared by Printing and Plating Process
Cited 54 time in scopus Share share facebook twitter linkedin kakaostory
Authors
Doo-Hee Cho, O Eun Kwon, Young-Sam Park, Byoung Gon Yu, Jonghee Lee, Jaehyun Moon, Hyunsu Cho, Hyunkoo Lee, Nam Sung Cho
Issue Date
2017-11
Citation
Organic Electronics, v.50, pp.170-176
ISSN
1566-1199
Publisher
Elsevier
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1016/j.orgel.2017.07.041
Abstract
We developed a cost-effective process to fabricate a flexible integrated organic light-emitting diode (OLED) substrate using a screen printing, an electroless copper plating, and a delamination process. Photolithographic method and expensive material such as silver paste were not used. Green OLED devices with the flexible integrated substrates were successfully fabricated, and the electro-optical characteristics such as leakage current and external quantum efficiency of the flexible OLED devices were comparable to those of OLED devices with a glass substrate. The process of this study is suitable for the low cost production of flexible OLED lighting panels.
KSP Keywords
Electroless copper(EC), External quantum Efficiency, Flexible oled, Glass substrate, OLED devices, OLED lighting, Optical characteristics, Organic light-emitting diodes(OLED), Silver Paste, cost-effective, electro-optical