ETRI-Knowledge Sharing Plaform

KOREAN
논문 검색
Type SCI
Year ~ Keyword

Detail

Journal Article 4차 산업 혁명의 숨은 혁신 기술: 전자 패키징 기술
Cited - time in scopus Download 182 time Share share facebook twitter linkedin kakaostory
Authors
최광성, 문석환, 배현철, 장건수, 엄용성
Issue Date
2017-12
Citation
전자통신동향분석, v.32, no.6, pp.17-26
ISSN
1225-6455
Publisher
한국전자통신연구원 (ETRI)
Language
Korean
Type
Journal Article
DOI
https://dx.doi.org/10.22648/ETRI.2017.J.320603
Project Code
17PB1300, Development of ultra precision stack bonding equipment for different packages using variable-area of laser, Choi Kwang-Seong
Abstract
Electronic packaging technology is a technology that easily connects devices to the outside. The fourth industrial revolution is thought to be possible with the advancement of certain devices. The advancement of these devices must be accompanied by innovations in electronic packaging that connects the devices to the outside world, allowing their performances to be implemented at the system level. In this paper, the development trends of 2.5D/3D technology, heterogeneous integration technology, ultrafine interconnection technology, and heat dissipation technology will be examined, and the development direction of these technologies will be discussed.
KSP Keywords
3D Technology, Development direction, Development trends, Heat dissipation technology, electronic packaging technology, fourth industrial revolution, heterogeneous integration, integration technology, system level
This work is distributed under the term of Korea Open Government License (KOGL)
(Type 4: : Type 1 + Commercial Use Prohibition+Change Prohibition)
Type 4: