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Journal Article Hidden Innovations in the Fourth Industrial Revolution: Electronic Packaging Technology
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Authors
Choi Kwang-Seong, Moon Seok-Hwan, Bae Hyun-Cheol, Keonsoo Jang, Eom Yong Sung
Issue Date
201712
Source
전자통신동향분석, v.32 no.6, pp.17-26
ISSN
1225-6455
Publisher
한국전자통신연구원 (ETRI)
DOI
https://dx.doi.org/10.22648/ETRI.2017.J.320603
Project Code
17PB1300, Development of ultra precision stack bonding equipment for different packages using variable-area of laser, Choi Kwang-Seong
This work is distributed under the term of Korea Open Government License (KOGL)
(Type 4: : Type 1 + Commercial Use Prohibition+Change Prohibition)
Type 4: