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Conference Paper Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser

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Authors: Kwang-Seong Choi, Wagno Alves Braganca Junior, Keon-Soo Jang, Hyun-Cheol Bae, Yong-Sung Eom

Issue Date: 2017-12

Citation: International Microelectronics Assembly and Packaging Society (IMAPS) 2017, pp.1-5

Language: English

Type: Conference Paper

DOI: https://dx.doi.org/10.4071/isom-2017-TP31_027

Project Code: 17PB1300, Development of ultra precision stack bonding equipment for different packages using variable-area of laser, Choi Kwang-Seong

KSP Keywords: 3D TSV, Through silicon vias(TSV)

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