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Conference Paper
전력 반도체 패키지 공정에서의 Al Wire Bonding 공정
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- Issue Date
- 2017-07
- Citation
- 대한전자공학회 종합 학술 대회 (하계) 2017, pp.229-231
- Language
- Korean
- Type
- Conference Paper
- Project Code
- 17PB2200, 80W/m·K High Heat Radiation Cu-based bonding material for power conversion Device of Electric Vehicle to cope with Emission control, Bae Hyun-Cheol
- KSP Keywords
- Al wire, Wire bonding