상세정보
학술지
3D Printing Based Single-Build Process for Electronic Devices
- 발행일
- 201710
- 출처
- Journal of Nanoscience and Nanotechnology, v.17 no.10, pp.7259-7263
- ISSN
- 1533-4880
- 출판사
- American Scientific Publishers (ASP)
- 초록
- Electronic components that are fabricated by 3D printing are still struggling in performance compared to those fabricated using conventional materials and methods. In this study, we present a novel process for fabricating electronic devices that can utilize existing commercialized electronic components, by embedding them inside a 3D printed structure. A wiring process was designed to interconnect the electronic components and 3D structure. The surface roughness of the 3D structure plays a crucial role in the conduction performance, the quality of the 3D structure, and the overall device performance. Electronic components are placed according to the wiring design at required intervals and simultaneously Delivered connections by Ingentaare to:automatically Elsevier BVmade between the electronic components. This process IP: 203.56.241.128 makes it possible On: toMon, employ 24 the Jul high 2017performance 05:55:08 of commercialized and mature semiconductorCopyright: process based American components Scientific usingPublishers SMD in the proposed devices. This process will provide a high value single-build fabrication method that can be used to create unique designs with high electric performance, and overcomes the limitations of mechanical machining by fabricating built-in electronic components in a 3D structure.
- KSP 제안 키워드
- 3D printed structure, 3D printing, 3D structure, Built-in, Electronic components, Fabrication method, High electric performance, Mechanical machining, Novel process, Surface roughness, conduction performance