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Conference Paper
PCB Stack-up에 따른 마이크로 서버 시스템 연결망 모듈의 BER 비교
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- Issue Date
- 2017-11
- Citation
- 대한전자공학회 종합 학술 대회 (추계) 2017, pp.172-175
- Publisher
- 대한전자공학회
- Language
- Korean
- Type
- Conference Paper
- Abstract
- This paper is related with the signal integrity depending on the stack-up type of PCB in the high-speed signal of a system interconnection module supporting 800Gbps bandwidth. We designed two types of PCB stack-up, the one has 12 layers and another has 14 layers, having 14.t and 1.6t thickness each. The result shows that the high-speed signal integrity placing a signal layer between two power layers has a better quality than placing two signal layers between two power layers.
- KSP Keywords
- High Speed, Signal Integrity(SI), Signal Layer, System interconnection, stack-up