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학술대회 Comparison BER with the Different Stack-Up PCB of KOSMOS Micro-Server System Interconnection Module Supporting 800Gbps Bandwidth
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권혁제, 신지호, 권원옥, 김학영, 강동재
International Conference on Information Technology (ICIT) 2017, pp.201-205
This paper is related to implementing PCB for the high-speed signal of a system interconnection module having 800Gbps bandwidth in a KOSMOS micro-server. We select the Serial RapidIO as the system interconnection network for the KOSMOS micro-server. The bandwidth of an interconnection module, which is communicating with 8 CPUs on two compute cards, is 800Gbps. The module is designed into 12 layers and 14 layers having 1.4T and 1.8T thickness with two different PCB stack-up. The implementation result shows that the high-speed signal integrity placing a signal layer between two power layers has a better quality than placing two signal layers between two power layers.
KSP 제안 키워드
High Speed, Serial RapidIO, Signal Integrity(SI), Signal Layer, System interconnection, interconnection network, stack-up