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Conference Paper
Comparison BER with the Different Stack-Up PCB of KOSMOS Micro-Server System Interconnection Module Supporting 800Gbps Bandwidth
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- Authors
- Hyukje Kwon, Ziho Shin, Won-ok Kwon, Hag-Young Kim, Dongjae Kang
- Issue Date
- 2017-12
- Citation
- International Conference on Information Technology (ICIT) 2017, pp.201-205
- Language
- English
- Type
- Conference Paper
- Project Code
- 17HS4100, 클라우드 인프라를 위한 초절전형 고집적 마이크로 서버 시스템 기술개발, Kim Hag Young
- Abstract
- This paper is related to implementing PCB for the high-speed signal of a system interconnection module having 800Gbps bandwidth in a KOSMOS micro-server. We select the Serial RapidIO as the system interconnection network for the KOSMOS micro-server. The bandwidth of an interconnection module, which is communicating with 8 CPUs on two compute cards, is 800Gbps. The module is designed into 12 layers and 14 layers having 1.4T and 1.8T thickness with two different PCB stack-up. The implementation result shows that the high-speed signal integrity placing a signal layer between two power layers has a better quality than placing two signal layers between two power layers.
- KSP Keywords
- High Speed, Serial RapidIO, Signal Integrity(SI), Signal Layer, System interconnection, interconnection network, stack-up