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Conference Paper Comparison BER with the Different Stack-Up PCB of KOSMOS Micro-Server System Interconnection Module Supporting 800Gbps Bandwidth
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Authors
Hyukje Kwon, Ziho Shin, Won-ok Kwon, Hag-Young Kim, Dongjae Kang
Issue Date
2017-12
Citation
International Conference on Information Technology (ICIT) 2017, pp.201-205
Language
English
Type
Conference Paper
DOI
https://dx.doi.org/10.1145/3176653.3176672
Project Code
17HS4100, 클라우드 인프라를 위한 초절전형 고집적 마이크로 서버 시스템 기술개발, Kim Hag Young
Abstract
This paper is related to implementing PCB for the high-speed signal of a system interconnection module having 800Gbps bandwidth in a KOSMOS micro-server. We select the Serial RapidIO as the system interconnection network for the KOSMOS micro-server. The bandwidth of an interconnection module, which is communicating with 8 CPUs on two compute cards, is 800Gbps. The module is designed into 12 layers and 14 layers having 1.4T and 1.8T thickness with two different PCB stack-up. The implementation result shows that the high-speed signal integrity placing a signal layer between two power layers has a better quality than placing two signal layers between two power layers.
KSP Keywords
High Speed, Serial RapidIO, Signal Integrity(SI), Signal Layer, System interconnection, interconnection network, stack-up