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학술지 Synchronous Curable Deoxidizing Capability of Epoxy-Anhydride Adhesive: Deoxidation Quantification via Spectroscopic Analysis
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장건수, 엄용성, 최광성, 배현철
Journal of Applied Polymer Science, v.135 no.33, pp.1-9
John Wiley & Sons
17PB4100, 유연 LED 모듈용 레이저 기반 청정 접합소재 및 공정 기술 개발, 엄용성
Thermoset resins have been extensively utilized as an adhesive for electronic devices. In particular, semiconductor packaging materials between chips/substrates require electrical interconnections by using deoxidizing agents along with thermoset adhesives. In this study, a facile combination of hydroxyl-functionalized epoxy and cyclohexane-structured cyclic anhydrides produced curable acidic moieties, thereby allowing synchronous deoxidizing and curing without the use of a deoxidizing agent. By contrast, unitary cyclic anhydrides rarely presented acidic moieties, probably due to their rapid networkable reactivity caused by structural flexibility once opened, which was detected and quantified by spectroscopic analyses. This binary system in the absence of additional deoxidizing agents achieved the complete wetting of common Sn-based solders via chip bonding systems due to the generated acidic moieties. The binary mixture also showed an increased glass transition temperature of 110 °C and enhanced Young's modulus of 1.6 GPa, relative to the ternary mixture (85 °C and 0.8 GPa) comprising a deoxidizing agent. This discovery is beneficial in terms of the simplification of composition design and mechanical robustness of solderable adhesives. Quantification via spectroscopic studies can also help anticipate the deoxidizing capability of binary and ternary systems at different temperatures for various bondable and solderable applications. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 46639.
KSP 제안 키워드
Binary mixture, Binary system, Complete wetting, Composition design, Cyclic anhydrides, Different temperatures, Epoxy-anhydride, Glass transition temperature, Hydroxyl-functionalized, Semiconductor packaging, Sn-based solders