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Conference Paper
Low Cost 400-Gbps Micro-Intradyne Coherent Receiver Using Chip-to-Chip Bonding and FPCB Wirings
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- Authors
- Young-Tak Han, Seo-Young Lee, Jong-Hoi Kim, Young-Ho Ko, Hyun-Do Jung, Joong-Seon Choe, Chun-Ju Youn, Won-Seok Han, Seok-Tae Kim, Yongsoon Baek
- Issue Date
- 2018-07
- Citation
- Opto-Electronics and Communications Conference (OECC) 2018, pp.1-2
- Language
- English
- Type
- Conference Paper
- Abstract
- A cost-effective 400-Gbps Micro-ICR using chip-to-chip bonding and DC and RF FPCB wirings has been developed. A BER of 2×10-2 is achieved for an OSNR of 23.8 dB when receiving 512-Gbps (64-GBaud DP-16QAM) signals.
- KSP Keywords
- Coherent receiver, DP-16QAM, Low-cost, chip bonding, chip-to-chip, cost-effective