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Conference Paper Low Cost 400-Gbps Micro-Intradyne Coherent Receiver Using Chip-to-Chip Bonding and FPCB Wirings
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Authors
Young-Tak Han, Seo-Young Lee, Jong-Hoi Kim, Young-Ho Ko, Hyun-Do Jung, Joong-Seon Choe, Chun-Ju Youn, Won-Seok Han, Seok-Tae Kim, Yongsoon Baek
Issue Date
2018-07
Citation
Opto-Electronics and Communications Conference (OECC) 2018, pp.1-2
Language
English
Type
Conference Paper
DOI
https://dx.doi.org/10.1109/OECC.2018.8729927
Abstract
A cost-effective 400-Gbps Micro-ICR using chip-to-chip bonding and DC and RF FPCB wirings has been developed. A BER of 2×10-2 is achieved for an OSNR of 23.8 dB when receiving 512-Gbps (64-GBaud DP-16QAM) signals.
KSP Keywords
Coherent receiver, DP-16QAM, Low-cost, chip bonding, chip-to-chip, cost-effective