상세정보
학술대회
Low Cost 400-Gbps Micro-Intradyne Coherent Receiver Using Chip-to-Chip Bonding and FPCB Wirings
- 발행일
- 201807
- 출처
- Opto-Electronics and Communications Conference (OECC) 2018, pp.1-2
- 협약과제
- 17HB2300, 소프트웨어 정의 네트워크(SDN) 기반 Flexible 광노드 핵심기술 개발, 백용순
- 초록
- A cost-effective 400-Gbps Micro-ICR using chip-to-chip bonding and DC and RF FPCB wirings has been developed. A BER of 2×10-2 is achieved for an OSNR of 23.8 dB when receiving 512-Gbps (64-GBaud DP-16QAM) signals.
- KSP 제안 키워드
- Coherent receiver, DP-16QAM, Low-cost, chip bonding, chip-to-chip, cost-effective