상세정보
학술대회
Bandwidth Improvement of DML by Change of Bondwire Length
- 발행일
- 201807
- 출처
- Opto-Electronics and Communications Conference (OECC) 2018, pp.1-2
- 협약과제
- 18ZB1100, 3D Photo-Electronics 원천기술 개발, 백용순
- 초록
- Improvement of modulation bandwidth of a DML according to bondwire lengths is demonstrated. The measured data show that a 3-dB bandwidth of a DML submodule can be extended to 28.3 GHz through variations of the bondwire length.
- KSP 제안 키워드
- 3-dB bandwidth, Bandwidth improvement, Modulation bandwidth, measured data