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학술지 Crosslinkable Deoxidizing Hybrid Adhesive of Epoxy-diacid for Electrical Interconnections in Semiconductor Packaging
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장건수, 엄용성, 최광성, 배현철
Polymer International, v.67 no.9, pp.1241-1247
John Wiley & Sons
17HB2800, ICT 반도체 본딩용 다기능 one-stop 접합 소재 개발, 엄용성
For electrical interconnections in semiconductor packaging, epoxy-based pastes have recently attracted considerable interest due to their excellent adhesion to various substrates and their reasonable electrical and mechanical properties, especially when combined with deoxidizing agents (to remove metallic oxides). Here, epoxy?밺iacid-based hybrid pastes were examined to achieve a deoxidizing capability for eliminating Sn-based solder oxides and adhesion between microchip and substrate as a one-step process. Onset, exothermic peak and end temperatures of the reaction between epoxy and diacids were systematically probed using DSC, rheometry and Fourier transform infrared (FTIR) spectroscopy. The last moment of the adhesive reaction during heating substantially enhanced the thermal and mechanical properties of the epoxy?밺iacid adhesive despite the absence of exothermic enthalpy detected by DSC. The glass transition temperature (Tg) and Young's modulus gradually decreased as a function of aliphatic chain length of diacids except when the length was extremely short and voids were produced. Soldering (wetting) and deoxidizing capabilities of the hybrid adhesive were observed via optical microscopy and FTIR. The correlation between the reaction, Tg, conversion and viscosity was also investigated. Lastly, complete wetting and electrical interconnection with good mechanical robustness were achieved for a commercial chip/substrate set by flip-chip bonding. © 2018 Society of Chemical Industry.
KSP 제안 키워드
Aliphatic chain, Chain length, Chemical Industry, Complete wetting, Epoxy-based, Flip-chip bonding, Fourier transform infrared (FT-IR) spectroscopy, Glass transition temperature, Hybrid adhesive, Mechanical properties(PMCs), Metallic oxides