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Detail
Conference Paper
Interconnection Process using Laser and Hybrid Underfill for LED Array Module on PET Substrate
- Authors
- Kwang-Seong Choi, Wagno Alves Braganca Junior, leeseul Jeong, Keon-Soo Jang, Seok Hwan Moon, Hyun-Cheol Bae, Yong-Sung Eom, Min Kyo Cho, Seung Il Chang
- Issue Date
- 2018-06
- Citation
- Electronic Components and Technology Conference (ECTC) 2018, pp.1561-1567
- Language
- English
- Type
- Conference Paper
- Project Code
- 18PB1600, Development of ultra precision stack bonding equipment for different packages using variable-area of laser, Choi Kwang-Seong
- Abstract
- Flexible displays and electronics are emerging technology. A PET substrate is one the strong candidate substrate materials for the applications, however, its low thermal stability limited its penetration depth in the market. We propose the interconnection process using laser and hybrid underfill as a technical solution to prevent the thermal deformation of a PET film during the interconnection process. The LED module array is successfully fabricated on a PET substrate using laser and hybrid underfill. The process features a very short cycle time and tiling process for the high throughput.
- KSP Keywords
- Cycle Time, Emerging technology, High throughput(HTP), LED array, LED module, PET film, PET substrate, Substrate material, Thermal deformation, Thermal stability(TGA), flexible display