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학술대회 Interconnection Process using Laser and Hybrid Underfill for LED Array Module on PET Substrate
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저자
최광성, 주니어, 정이슬, 장건수, 문석환, 배현철, 엄용성, 조민교, 장승일
발행일
201806
출처
Electronic Components and Technology Conference (ECTC) 2018, pp.1561-1567
DOI
https://dx.doi.org/10.1109/ECTC.2018.00238
협약과제
18PB1600, 가변영역 레이저를 이용한 이종 패키지 제조용 초정밀 스택 본딩 장비 개발, 최광성
초록
Flexible displays and electronics are emerging technology. A PET substrate is one the strong candidate substrate materials for the applications, however, its low thermal stability limited its penetration depth in the market. We propose the interconnection process using laser and hybrid underfill as a technical solution to prevent the thermal deformation of a PET film during the interconnection process. The LED module array is successfully fabricated on a PET substrate using laser and hybrid underfill. The process features a very short cycle time and tiling process for the high throughput.
KSP 제안 키워드
Cycle Time, Emerging technology, High throughput(HTP), LED array, LED module, PET film, PET substrate, Substrate material, Thermal deformation, Thermal stability(TGA), flexible display