상세정보
학술대회
Interconnection Process using Laser and Hybrid Underfill for LED Array Module on PET Substrate
- 발행일
- 201806
- 출처
- Electronic Components and Technology Conference (ECTC) 2018, pp.1561-1567
- 협약과제
- 18PB1600, 가변영역 레이저를 이용한 이종 패키지 제조용 초정밀 스택 본딩 장비 개발, 최광성
- 초록
- Flexible displays and electronics are emerging technology. A PET substrate is one the strong candidate substrate materials for the applications, however, its low thermal stability limited its penetration depth in the market. We propose the interconnection process using laser and hybrid underfill as a technical solution to prevent the thermal deformation of a PET film during the interconnection process. The LED module array is successfully fabricated on a PET substrate using laser and hybrid underfill. The process features a very short cycle time and tiling process for the high throughput.
- KSP 제안 키워드
- Cycle Time, Emerging technology, High throughput(HTP), LED array, LED module, PET film, PET substrate, Substrate material, Thermal deformation, Thermal stability(TGA), flexible display