BROWSE
Detail
Conference Paper
Interconnection Process using Laser and Hybrid Underfill for LED Array Module on PET Substrate
Cited 15 time in 
Share 
Share
- Authors
- Kwang-Seong Choi, Wagno Alves Braganca Junior, leeseul Jeong, Keon-Soo Jang, Seok Hwan Moon, Hyun-Cheol Bae, Yong-Sung Eom, Min Kyo Cho, Seung Il Chang
- Issue Date
- 2018-06
- Citation
- Electronic Components and Technology Conference (ECTC) 2018, pp.1561-1567
- Publisher
- IEEE
- Language
- English
- Type
- Conference Paper
- Abstract
- Flexible displays and electronics are emerging technology. A PET substrate is one the strong candidate substrate materials for the applications, however, its low thermal stability limited its penetration depth in the market. We propose the interconnection process using laser and hybrid underfill as a technical solution to prevent the thermal deformation of a PET film during the interconnection process. The LED module array is successfully fabricated on a PET substrate using laser and hybrid underfill. The process features a very short cycle time and tiling process for the high throughput.
- KSP Keywords
- Emerging technology, High throughput, LED Array, LED module, PET film, PET substrate, Substrate material, Thermal deformation, cycle time, flexible display, penetration depth