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Journal Article High Figure-of-Merit (V 2 BR /R ON ) AlGaN/GaN Power HEMT With Periodically C-Doped GaN Buffer and AlGaN Back Barrier
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Authors
JUN-HYEOK LEE, JEONG-MIN JU, GOKHAN ATMACA, JEONG-GIL KIM, SEUNG-HYEON KANG, YONG SOO LEE, SANG-HEUNG LEE, JONG-WON LIM, HO-SANG KWON, SEFER BORA LISESIVDIN, JUNG-HEE LEE
Issue Date
2018-10
Citation
IEEE Journal of the Electron Devices Society, v.6, pp.1179-1186
ISSN
2168-6734
Publisher
IEEE
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1109/JEDS.2018.2872975
Abstract
In this paper, we investigated characteristics of AlGaN/GaN high-electron mobility transistors (HEMTs) with high resistive buffer structure consisted of periodically carbon-doped (PCD) GaN buffer layer and AlGaN back barrier layer. The PCD structure was proposed for reducing undesirable trapping effects, which resulted in effective suppression of the current collapse compared to that in conventional carbon buffer structure. To further improve the dynamic performances of the device and to increase the electron confinement of the 2-D electron gas (2-DEG) channel, AlGaN back barrier was inserted between the GaN channel and the PCD buffer layer, which results in greatly improved current collapse with slightly improved 2-DEG mobility compared to those of the device without back barrier. The OFF-state leakage current of the device with back-barrier is about 2 orders lower in magnitude than that of device without back barrier, which leads to the breakdown voltage of 2 kV and figure of merit of 2.27 GV2 廓-1 cm-2 for the device with LGD of 10μm , one of the highest values ever reported for the GaN-based HEMTs.
KSP Keywords
2-D electron gas, Back barrier, Breakdown Voltage, C-doped, Carbon-doped, Dynamic performance, Figure of Merit(FoM), GaN buffer layer, GaN-Based, High-electron mobility transistor(HEMT), Leakage Current
This work is distributed under the term of Creative Commons License (CCL)
(CC BY NC ND)
CC BY NC ND