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Conference Paper High-Speed Signal Integrity Design for HDCA Systems
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Authors
Wonok Kwon, Young Woo Kim
Issue Date
2018-10
Citation
International Conference on Information and Communication Technology Convergence (ICTC) 2018, pp.1267-1269
Publisher
IEEE
Language
English
Type
Conference Paper
DOI
https://dx.doi.org/10.1109/ICTC.2018.8539639
Abstract
This paper presents a reliable design method through signal integrity (SI) analysis, procedure, and debugging in high speed PCB production. Especially, it deals with high speed SI analysis process in computer system expansion board HDCA system PCB design. Pre PCB simulation and post PCB TDR measurement, results and analysis are described.
KSP Keywords
Analysis Process, Computer systems, Design method, High Speed, PCB Design, Reliable design, Signal Integrity(SI), System expansion