ETRI-Knowledge Sharing Plaform



논문 검색
구분 SCI
연도 ~ 키워드


학술대회 A Solution of Aluminum Flat Heat Pipe for Dry Cooling the Ladar Array
Cited 0 time in scopus Download 1 time Share share facebook twitter linkedin kakaostory
홍수현, 문석환, 최광성, 이진호, 김현탁
International Heat Transfer Conference (IHTC) 2018, pp.1-8
18HB1900, 휴대 단말용 급격한 전하방전 저전압 스위칭 소자 원천기술 개발, 김현탁
The power amplifiers for high-speed radio frequency(RF) consume a large amount of power and create thermal burden. Even in the case of power amplifiers based on GaN component devices, which have recently entered maturity in the market and showed an excellent RF power output, the heat flux per module is close to 190 W/cm2, thereby causing thermal management burden. When considering the thermal management of the power module, the direct contact air cooling method using aluminum heat sink or the cooling method using newly designed heat dissipation package structures can be used in unit modules or a small number of array systems. When the number of arrays increases and the power consumption is large, liquid cooling methods, such as maximizing the cooling performance through optimizing the design of the liquid flow path or designing the cooling liquid line as close as possible to the heat source in the power package module, are mainly considered. However, the close contact of the liquid lines to the heat source may form a dewdrop in the package module, thereby reducing reliability especially in the case of a radar system with power array modules. As an alternative, dry cooling methods using heat pipes have been studied, but radar array package modules have not attracted much research attention. In this study, an aluminum flat heat pipe for a 1×4 array module for the RF power amplifier of the next generation X-band radar was developed. This module is lightweight, is based on aluminum material, has a flat shape, and facilitates antenna interconnection through its hole structures. An aluminum flat heat pipe with an antenna interconnection structure was then designed and fabricated, and the temperature limit in the GaN power device and the temperature distribution in the whole package module were evaluated by performing tests in the structure of the 1 × 4 antenna array module and in the condition of 28 W power per module.
KSP 제안 키워드
Close contact, Cooling liquid, Cooling method, Flow path, GaN power device, Generation X, Heat Dissipation, Heat flux, Heat sink, Heat source, High Speed