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Journal Article 다차원 이종 복합 디바이스 인터커넥션 기술 - 레이저 기반 접합 기술
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Authors
최광성, 문석환, 엄용성
Issue Date
2018-12
Citation
전자통신동향분석, v.33, no.6, pp.50-57
ISSN
1225-6455
Publisher
한국전자통신연구원 (ETRI)
Language
Korean
Type
Journal Article
DOI
https://dx.doi.org/10.22648/ETRI.2018.J.330606
Abstract
As devices have evolved, traditional flip chip bonding and recently commercialized thermocompression bonding techniques have been limited. Laser-assisted bonding is attracting attention as a technology that satisfies both the requirements of mass production and the yield enhancement of advanced packaging interconnections, which are weak points of these bonding technologies. The laser-assisted bonding technique can be applied not only to a two-dimensional bonding but also to a three-dimensional stacked structure, and can be applied to various types of device bonding such as electronic devices; display devices, e.g., LEDs; and sensors.
KSP Keywords
Advanced packaging, Bonding technique, Display device, Flip-chip(FC), Flip-chip bonding, Laser-Assisted Bonding, Three dimensional(3D), electronic devices, mass production, stacked structure, thermocompression bonding
This work is distributed under the term of Korea Open Government License (KOGL)
(Type 4: : Type 1 + Commercial Use Prohibition+Change Prohibition)
Type 4: