BROWSE
Detail
Journal Article
다차원 이종 복합 디바이스 인터커넥션 기술 - 레이저 기반 접합 기술
- Issue Date
- 2018-12
- Citation
- 전자통신동향분석, v.33, no.6, pp.50-57
- ISSN
- 1225-6455
- Publisher
- 한국전자통신연구원 (ETRI)
- Language
- Korean
- Type
- Journal Article
- Abstract
- As devices have evolved, traditional flip chip bonding and recently commercialized thermocompression bonding techniques have been limited. Laser-assisted bonding is attracting attention as a technology that satisfies both the requirements of mass production and the yield enhancement of advanced packaging interconnections, which are weak points of these bonding technologies. The laser-assisted bonding technique can be applied not only to a two-dimensional bonding but also to a three-dimensional stacked structure, and can be applied to various types of device bonding such as electronic devices; display devices, e.g., LEDs; and sensors.
- KSP Keywords
- Advanced packaging, Bonding technique, Display device, Flip-chip(FC), Flip-chip bonding, Laser-Assisted Bonding, Three dimensional(3D), electronic devices, mass production, stacked structure, thermocompression bonding
This work is distributed under the term of Korea Open Government License (KOGL)
(Type 4: : Type 1 + Commercial Use Prohibition+Change Prohibition)
(Type 4: : Type 1 + Commercial Use Prohibition+Change Prohibition)
