AlGaN/GaN heterostructures were successfully grown with the AlIn(Ga)N back barrier at 900 °C. However, the atomic composition of the AlIn(Ga)N layer was strongly dependent on the growth pressure, which resulted in a different lattice constant of the layer. The AlIn(Ga)N back barrier grown at 400 torr was almost lattice-matched to GaN layer. The AlGaN/GaN heterostructures with 10 and 15 nm-thick AlIn(Ga)N back barrier exhibited improved 2-DEG properties, compared to those of the conventional AlGaN/GaN heterostructure without the back barrier. The high electron mobility transistors (HEMTs) fabricated on the AlGaN/GaN heterostructure with a 15 nm-thick AlIn(Ga)N back barrier exhibited a very low off-state leakage current of ~2 × 10?닋7 A/mm which is about 1 order lower in magnitude than the value of the device without the back barrier. The AlIn(Ga)N back barrier is a promising candidate as an alternative to conventional AlGaN and InGaN back barrier.
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