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소형의 평판형 냉각 장치 개발
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- 발행일
- 201009
- 출처
- 설비공학논문집, v.22 no.9, pp.614-619
- ISSN
- 1229-6422
- 출판사
- 대한설비공학회
- 협약과제
- 09MB7700, 솔라셀 증착용 온도균일화 장치 개발, 문석환
- 초록
- Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of a slimness of the devices, so it is not easy to find the optimal thermal management solution for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint of the applications. In the present study, the silicon flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. The normal isothermal characteristics created by vapor-liquid phase change was confirmed through the experimental study. The cooling device with 70 mm of total length showed 6.8 W of the heat transfer rate within the range of 4∼5℃/W of thermal resistance. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of the silicon and glass cooling device.
- KSP 제안 키워드
- Experimental study, Flat plate, Flow path, Glass cooling, Heat transfer rate, Vapor-liquid phase change, cooling device, fabrication process, liquid flow, telecommunication devices, thermal management