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Conference Paper
A Study of Overflowed Epoxy Resin in a Butt-coupling with FAB and EML Mounted on PCB for a Compact Optic Design of Ethernet 100G/400G CWDM4 Data Center Application
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- Authors
- Jyung Chan Lee, Joon Ki Lee, Eun-Gu Lee, Kyeongwan Jeon, Sang Wan Park, Changhyun Kang, Jong Ha Moon
- Issue Date
- 2019-11
- Citation
- Asia Communications and Photonics Conference (ACP) 2019, pp.1-3
- Publisher
- IEEE
- Language
- English
- Type
- Conference Paper
- Abstract
- We investigated results of overflowed epoxy resin in a butt-coupling. We could obtain the higher coupling efficiency due to the narrower beam divergence and explain the better heat transfer utilizing conduction and convection mechanism.