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학술대회 A Study of Overflowed Epoxy Resin in a Butt-coupling with FAB and EML Mounted on PCB for a Compact Optic Design of Ethernet 100G/400G CWDM4 Data Center Application
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저자
이정찬, 이준기, 이은구, 전경완, 박상완, 강창현, 문종하
발행일
201911
출처
Asia Communications and Photonics Conference (ACP) 2019, pp.1-3
협약과제
19HH2200, 메가 데이터 센터 대용량 광연결을 위한 임베디드 옵틱 기반의 저가형 400Gb/s QSFP-DD 광트랜시버 기술 개발, 이정찬
초록
We investigated results of overflowed epoxy resin in a butt-coupling. We could obtain the higher coupling efficiency due to the narrower beam divergence and explain the better heat transfer utilizing conduction and convection mechanism.
KSP 제안 키워드
Beam Divergence, Coupling with, Data center, Epoxy resin, Heat Transfer, Optic design, butt-coupling, conduction and convection, coupling efficiency