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Switching Performances by Chip Interconnections in Power Semiconductor Discrete Packages
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- 발행일
- 201911
- 출처
- International Symposium on Microelectronics and Packaging / Electronic Materials and Packaging(EMAP) Conference (ISMP-EMAP) 2019, pp.136-137
- 협약과제
- 19PB3900, 1700V/250A급 저손실 Full-SiC Half-bridge Power Module 개발, 정동윤
- KSP 제안 키워드
- Power semiconductor