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Conference Paper Switching Performances by Chip Interconnections in Power Semiconductor Discrete Packages

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Authors: Dong Yun Jung, Hyun Gyu Jang, Jong Moon Park, Dongwoo Suh, Yun Hwa Choi, Yong Ha Lee

Issue Date: 2019-11

Citation: International Symposium on Microelectronics and Packaging / Electronic Materials and Packaging(EMAP) Conference (ISMP-EMAP) 2019, pp.136-137

Language: English

Type: Conference Paper

KSP Keywords: Power semiconductor

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