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학술대회 Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration
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저자
최광성, 엄용성, 문석환, 주지호, 이광주, 김정학, 김주현
발행일
201910
출처
International 3D Systems Integration Conference (3DIC) 2019, pp.1-3
DOI
https://dx.doi.org/10.1109/3DIC48104.2019.9058890
협약과제
19PB1600, 유연 디스플레이소자용 열공정 기술 및 장치 개발, 최광성
초록
Laser-Assisted Bonding with Compression (LABC) technology with NCF was proposed to accomplish the productivity and process reliability at the same time. A quartz block as a header was used to deliver a pressure to the devices because of its extremely low absorption of the laser during the bonding process. Newly developed NCF for LABC was designed to have stability on a hot stage and to show solder wetting and fast curing with no void and optimal fillet during the LABC bonding process. As the laser is used as a heat source, the uniform heat should be provided on each interconnection without any damages on chip or a substrate. 780μ-Thick daisy chain top and bottom chips with the minimum pitch of 30m and bump number of about 27, 000 were successfully bonded using the LABC and NCF film.
KSP 제안 키워드
3D IC Integration, Bonding process, Fast curing, Heat source, Hot stage, Laser-Assisted Bonding, Process reliability, daisy chain