상세정보
학술지
Optical Subassembly Modules Using Light Sources Butt-Coupled With Silica-Based PLC
- 발행일
- 202001
- 출처
- IEEE Photonics Technology Letters, v.32 no.2, pp.132-135
- ISSN
- 1041-1135
- 출판사
- IEEE
- 협약과제
- 19HB2100, 데이터센터 통신용량 증대를 위한 저전력 On-Board 집적 400Gbps 광송수신 엔진 기술, 백용순
- 초록
- We have fabricated DML/EML-based subassembly modules based on chip-to-chip optical butt-coupling with straight waveguides between a silica AWG chip and commercial directly modulated laser (DML) or electro-absorption modulated laser (EML) chips. By properly inducing external optical feedback on the DML chips, we experimentally demonstrate that 3-dB bandwidths of the DML-based subassembly module can be increased by 5 9.5 GHz compared with those of commercial 28-Gbaud DML chips. The EML-based subassembly module exhibits optical characteristics insensitive to the external optical reflection with a side mode suppression ratio (SMSR) of over 50 dB, revealing excellent optical eye patterns under 112-Gbps PAM4 operations.
- KSP 제안 키워드
- 9.5 GHZ, Coupled with, Coupling with, Directly modulated laser(DML), Electro-absorption, Light sources, Optical characteristics, Silica-based, butt-coupling, chip-to-chip, eye patterns