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Optical Subassembly Modules Using Light Sources Butt-Coupled With Silica-Based PLC
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- Authors
- Seok-Jun Yun, Young-Tak Han, Seok-Tae Kim, Jang-Uk Shin, Sang-Ho Park, Dong-Hoon Lee, Seo-Young Lee, Yongsoon Baek
- Issue Date
- 2020-01
- Citation
- IEEE Photonics Technology Letters, v.32, no.2, pp.132-135
- ISSN
- 1041-1135
- Publisher
- IEEE
- Language
- English
- Type
- Journal Article
- Abstract
- We have fabricated DML/EML-based subassembly modules based on chip-to-chip optical butt-coupling with straight waveguides between a silica AWG chip and commercial directly modulated laser (DML) or electro-absorption modulated laser (EML) chips. By properly inducing external optical feedback on the DML chips, we experimentally demonstrate that 3-dB bandwidths of the DML-based subassembly module can be increased by 5 9.5 GHz compared with those of commercial 28-Gbaud DML chips. The EML-based subassembly module exhibits optical characteristics insensitive to the external optical reflection with a side mode suppression ratio (SMSR) of over 50 dB, revealing excellent optical eye patterns under 112-Gbps PAM4 operations.
- KSP Keywords
- 9.5 GHZ, Coupled with, Coupling with, Directly modulated laser(DML), Electro-absorption, Light sources, Optical characteristics, Silica-based, butt-coupling, chip-to-chip, eye patterns