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Conference Paper 고방열 기판 및 접합 소재를 이용한 파워 모듈의 열 해석
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Authors
김동환, 오애선, 안현식, 박은영, 김경현, 전성재, 배현철
Issue Date
2020-08
Citation
대한전자공학회 학술 대회 (하계) 2020, pp.151-154
Publisher
대한전자공학회
Language
Korean
Type
Conference Paper
Abstract
In this paper, thermal analysis was performed to effectively manage the heat generated in a highpower module using SiC rather than the existing Si power module. The difference in the maximum temperature of the power module was analyzed using the other two substrates and the bonding materials. The substrates used were an existing Al2O3 DBC and an AlN DBC with high thermal conductivity. Then, PbSn Preform, which is used as a bonding material for existing power modules, and a heat dissipation efficient Ag/Cu Sintering Paste bonding material for thermal analysis and the results were compared.
KSP Keywords
Bonding material, Heat dissipation, Maximum temperature, Thermal Analysis, high thermal conductivity, power module