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Conference Paper
고방열 기판 및 접합 소재를 이용한 파워 모듈의 열 해석
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- Issue Date
- 2020-08
- Citation
- 대한전자공학회 학술 대회 (하계) 2020, pp.151-154
- Publisher
- 대한전자공학회
- Language
- Korean
- Type
- Conference Paper
- Abstract
- In this paper, thermal analysis was performed to effectively manage the heat generated in a highpower module using SiC rather than the existing Si power module. The difference in the maximum temperature of the power module was analyzed using the other two substrates and the bonding materials. The substrates used were an existing Al2O3 DBC and an AlN DBC with high thermal conductivity. Then, PbSn Preform, which is used as a bonding material for existing power modules, and a heat dissipation efficient Ag/Cu Sintering Paste bonding material for thermal analysis and the results were compared.
- KSP Keywords
- Bonding material, Heat dissipation, Maximum temperature, Thermal Analysis, high thermal conductivity, power module