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Conference Paper Multi-layer Ceramic based Surface Mount Device Packaging for 1200 V and 1700 V SiC SBD Power Semiconductors
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Authors
Dong Yun Jung, Hyun Gyu Jang, Doohyung Cho, Kun Sik Park, Jong-Won Lim, Yun Hwa Choi, Yong Ha Lee
Issue Date
2020-11
Citation
International Conference on Consumer Electronics (ICCE) 2020 : Asia, pp.603-606
Publisher
IEEE
Language
English
Type
Conference Paper
DOI
https://dx.doi.org/10.1109/ICCE-Asia49877.2020.9276963
Abstract
We propose a multi-layer ceramic based surface mount device (SMD) packaging for 1200 V and 1700 V silicon carbide (SiC) Schottky barrier diode (SBD) power semiconductors. The distance between anode and cathode on a ceramic substrate is 1.0 mm to achieve an isolation voltage performance over 2000 V. We implemented the proposed multi-layer ceramic based substrates with 8 mm x 8 mm size. Using the substrates, we fabricated three SMD typed power semiconductor packaging such as 1200 V/2 A, 1200 V/5 A, and 1700 V/5 A-class SiC SBD and evaluated forward/reverse static and dynamic performances. It is the world's first result of SMD packaging using a multi-layer ceramic substrate for 1200 and 1700 V SiC SBD.
KSP Keywords
1200 V, 700 V, Anode and cathode, Ceramic Substrate, Device packaging, Power semiconductor, Semiconductor packaging, SiC SBD, Static and dynamic performances, Surface mount device, Voltage performance