본 논문에서는 Ku-대역 위성이동 통신을 위한 능동 위상 배열 안테나에 사용되는 수신 및 송신 MMIC 다기능 칩을0.25 μm p-HEMT 상용 공정을 이용하여 개발하였다. 다기능 칩은 4:1 결합기를 포함한 4-채널 경로로 구성되며, 각 채널은 6-비트 디지털 위상 천이 기능, 5-비트 디지털 감쇠 기능, 신호 증폭 기능 등의 다양한 기능을 제공한다. 27 mm2(5.2 mm×5.2 mm) 칩 크기로 제작된 MMIC 다기능 칩은 7 mm×7 mm 크기의 상용 QFN 플라스틱 패키지에 조립 후 측정하였다. 측정결과, 수신 다기능 칩의 경우, 10.7~12.75 GHz에서 28 dB의 이득과 1.6 dB의 잡음지수 특성을 보였다. 그리고위상 제어 시, 3°의 RMS 위상 오차와 감쇠 제어 시, 0.3 dB의 RMS 감쇠 오차를 보였다. 송신 다기능 칩의 경우, 1.27 W DC 소모 전력에 대해 13.75~14.5 GHz에서 15 dB의 이득과 16.4 dBm의 출력파워 특성을 보였다. 그리고 위상 제어시, 2.5°의 RMS 위상 오차와 감쇠 제어 시, 0.2 dB의 RMS 감쇠 오차를 보였다.
KSP Keywords
2 mm, 7 mm, GaAs MMIC, pseudomorphic high electron mobility transistor(pHEMT)
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