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Conference Paper
Analysis of Parasitic Effects by Bonding Structure
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- Authors
- Hyun Gyu Jang, Dong Yun Jung, Sungkyu Kwon, Doohyung Cho, Kun sik Park, Jong-Won Lim, Yun Hwa Choi
- Issue Date
- 2021-02
- Citation
- International Conference on Electronics, Information and Communication (ICEIC) 2021, pp.434-435
- Language
- English
- Type
- Conference Paper
- Abstract
- In this paper, a direct-bonded copper (DBC) substrate with wire-bonding and a DBC substrate with clip-bonding are designed and fabricated to compare inductance as their structure. Through a comparison of them, it is proved that the clip for the semiconductor package is suitable for decreasing inductance and direct current resistance (DCR). Also, the clip which has reduced inductance and DCR is expected to improve switching characteristics and efficiency in the power conversion system.
- KSP Keywords
- Bonding structure, DBC substrate, Direct current(DC), Direct current resistance(DCR), Parasitic effects, Semiconductor package, power conversion system, switching characteristics, wire bonding