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Organic/Inorganic Hybrid Thin-Film Encapsulation Using Inkjet Printing and PEALD for Industrial Large-Area Process Suitability and Flexible OLED Application
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- Authors
- Byoung-Hwa Kwon, Chul Woong Joo, Hyunsu Cho, Chan-mo Kang, Jong-Heon Yang, Jin-Wook Shin, Gi Heon Kim, Sukyung Choi, Sooji Nam, Kukjoo Kim, Chun-Won Byun, Nam Sung Cho, Sujung Kim
- Issue Date
- 2021-11
- Citation
- ACS Applied Materials & Interfaces, v.13, no.46, pp.54621-55766
- ISSN
- 1944-8244
- Publisher
- American Chemical Society (ACS)
- Language
- English
- Type
- Journal Article
- Project Code
- 21PB2800, Development of inkjet printing materials for flexible QD-OLEDs, Kwon Byoung-Hwa
- Abstract
- We present herein the first report of organic/inorganic hybrid thin-film encapsulation (TFE) developed as an encapsulation process for mass production in the display industry. The proposed method was applied to fabricate a top-emitting organic light-emitting device (TEOLED). The organic/inorganic hybrid TFE has a 1.5 dyad structure and was fabricated using plasma-enhanced atomic layer deposition (PEALD) and inkjet printing (IJP) processes that can be applied to mass production operations in the industry. Currently, industries use inorganic thin films such as SiNx and SiOxNy fabricated through plasma-enhanced chemical vapor deposition (PECVD), which results in film thickness >1 μm; however, in the present work, an Al2O3 inorganic thin film with a thickness of 30 nm was successfully fabricated using ALD. Furthermore, to decouple the crack propagation between the adjacent Al2O3 thin films, an acrylate-based polymer layer was printed between these layers using IJP to finally obtain the 1.5 dyad hybrid TFE. The proposed method can be applied to optoelectronic devices with various form factors such as rollables and stretchable displays. The hybrid TFE developed in this study has a transmittance of 95% or more in the entire visible light region and a very low surface roughness of less than 1 nm. In addition, the measurement of water vapor transmission rate (WVTR) using commercial MOCON equipment yielded a value of 5 × 10-5 gm-2 day-1 (37.8 °C and 100% RH) or less, approaching the limit of the measuring equipment. The TFE was applied to TEOLEDs and the improvement in optical properties of the device was demonstrated. The OLED panel was manufactured and operated stably, showing excellent consistency even in the actual display manufacturing process. The panel operated normally even after 363 days in air. The proposed organic/inorganic hybrid encapsulant manufacturing process is applicable to the display industry and this study provides basic guidelines that can serve as a foothold for the development of various technologies in academia and industry alike.
- KSP Keywords
- Crack propagation, Encapsulation process, Form factor, Inorganic thin films, Low surface roughness, Manufacturing processes, Measuring equipment, Organic light-emitting device(OLED), Organic-inorganic hybrid, Plasma-enhanced atomic layer deposition, Production Operations