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학술지 Organic/Inorganic Hybrid Thin-Film Encapsulation Using Inkjet Printing and PEALD for Industrial Large-Area Process Suitability and Flexible OLED Application
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권병화, 주철웅, 조현수, 강찬모, 양종헌, 신진욱, 김기현, 최수경, 남수지, 김국주, 변춘원, 조남성, 김수정
ACS Applied Materials & Interfaces, v.13 no.46, pp.54621-55766
American Chemical Society (ACS)
21PB2800, Flexible QD-OLED용 Ink-jet printing 소재/부품/장비 개발, 권병화
We present herein the first report of organic/inorganic hybrid thin-film encapsulation (TFE) developed as an encapsulation process for mass production in the display industry. The proposed method was applied to fabricate a top-emitting organic light-emitting device (TEOLED). The organic/inorganic hybrid TFE has a 1.5 dyad structure and was fabricated using plasma-enhanced atomic layer deposition (PEALD) and inkjet printing (IJP) processes that can be applied to mass production operations in the industry. Currently, industries use inorganic thin films such as SiNx and SiOxNy fabricated through plasma-enhanced chemical vapor deposition (PECVD), which results in film thickness >1 μm; however, in the present work, an Al2O3 inorganic thin film with a thickness of 30 nm was successfully fabricated using ALD. Furthermore, to decouple the crack propagation between the adjacent Al2O3 thin films, an acrylate-based polymer layer was printed between these layers using IJP to finally obtain the 1.5 dyad hybrid TFE. The proposed method can be applied to optoelectronic devices with various form factors such as rollables and stretchable displays. The hybrid TFE developed in this study has a transmittance of 95% or more in the entire visible light region and a very low surface roughness of less than 1 nm. In addition, the measurement of water vapor transmission rate (WVTR) using commercial MOCON equipment yielded a value of 5 × 10-5 gm-2 day-1 (37.8 °C and 100% RH) or less, approaching the limit of the measuring equipment. The TFE was applied to TEOLEDs and the improvement in optical properties of the device was demonstrated. The OLED panel was manufactured and operated stably, showing excellent consistency even in the actual display manufacturing process. The panel operated normally even after 363 days in air. The proposed organic/inorganic hybrid encapsulant manufacturing process is applicable to the display industry and this study provides basic guidelines that can serve as a foothold for the development of various technologies in academia and industry alike.
flexible organic light emitting diodes, inkjet printing, moisture and oxygen permeation barrier, organic/inorganic hybrid thin film encapsulation
KSP 제안 키워드
Crack propagation, Encapsulation process, Form factor, Inorganic thin films, Low surface roughness, Manufacturing processes, Measuring equipment, Organic light-emitting device(OLED), Organic light-emitting diodes(OLEDS), Organic-inorganic hybrid, Plasma-enhanced atomic layer deposition