In this study, we have revealed the threshold voltage shift mechanism corresponding to the proton radiation energy in GaN-based metal-insulator-semiconductor(MIS) high-electron mobility transistors(HEMTs). The MIS-HEMTs for 5 nm-thick SiN and HfO₂ gate insulator were fabricated. After the device processing, the γ-ray and proton were radiated for various irradiation conditions. Through the detailed electrical device characterization before and after the radiation, we figured out that the threshold voltage shift was determined by the competition between the total ionizing does effects and displacement damages, mainly generated inside of the gate insulator and semiconductor, respectively, in GaN-based MIS-HEMTs.
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