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Conference Paper
59‐5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini‐LED Display
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- Authors
- Kwang-Seong Choi, Jiho Joo, Yong-Sung Eom, Gwang-Mun Choi, Chanmi Lee, Ki-Seok Jang, Ho-Gyeong Yun, Seok Hwan Moon, Ji-Hoon Choi, Ji-Woong Choi
- Issue Date
- 2021-05
- Citation
- Society for Information Display (SID) International Symposium 2021, pp.841-844
- Language
- English
- Type
- Conference Paper
- Abstract
- We developed a simultaneous transfer and bonding (SITRAB) process based on laser-assisted bonding with compression (LABC) and our proprietary SITRAB adhesive technology. As its name implies, the SITRAB process performs transfer and bonding simultaneously, unlike the conventional sequential process, in which transfer is followed by the bonding process. SITRAB's process time is less than 6 s. The SITRAB adhesive was developed in the form of a paste and a film, and an appropriate type of adhesive can be applied depending on the applications. The adhesive was proved to be applied as SnAg and In solders during the SITRAB process. Two 35 x 35 arrays of 80 μm x 130 μm sized mini LEDs with a 288 μm pitch with SnAg or In interconnects have been successfully processed. The repair process based on SITRAB technology was proposed and confirmed experimentally.
- KSP Keywords
- Adhesive technology, Bonding process, LED display, Laser-Assisted Bonding, Repair process, Sequential process, process time