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Conference Paper Effect of Sintering Process on the Interfacial Reliability of Micro-nano Bimodal Cu Sintered Joints on Power Electronics Substrate

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Authors: Kirak Son, Aesun Oh, Eunyoung Park, Kyu Ho Yeon, Bum-Gyu Baek, Hyun-Cheol Bae

Issue Date: 2021-11

Citation: International Symposium on Microelectronics and Packaging (ISMP) 2021, pp.1-1

Language: English

Type: Conference Paper

KSP Keywords: Interfacial reliability, Micro-nano, Power Electronics, Sintering process

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