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Conference Paper
A Study on the Interfacial Reliability of Micro-nano Bimodal Cu Sintered Joints on DBC/AMB Substrates for Power Module
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- Authors
- Kirak Son, Aesun Oh, Eunyoung Park, Hyun-Cheol Bae
- Issue Date
- 2022-01
- Citation
- 한국반도체 학술대회 (KCS) 2022, pp.369-369
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Interfacial reliability, Micro-nano, power module