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Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate
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- 발행일
- 202207
- 출처
- International Conference and Exhibition on High Temperature Electronics Network (HiTEN) 2022, pp.66-70
- 협약과제
- 21IU1200, 국방 무기체계용 핵심 반도체 부품 자립화 플랫폼 개발, 임종원
- KSP 제안 키워드
- Heat Dissipation, High power, Insulated metal substrate, Wide Band Gap, power module