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Journal Article Thermal shock reliability of micro-nano bimodal Cu-Ag sintered joints
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Authors
Kirak Son, Aesun Oh, Eunyoung Park, Hyun-Cheol Bae
Issue Date
2022-08
Citation
Journal of Materials Science : Materials in Electronics, v.33, pp.17493-17501
ISSN
0957-4522
Publisher
Springer
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1007/s10854-022-08605-y
Project Code
21IU1200, Development of self-reliance platform in defense advanced semiconductor materials and components for weapon system, Jong-Won Lim
Abstract
In this study, we investigated the thermal shock reliability of die-attach technology using a micro?뱊ano bimodal Cu?밃g paste, which can considerably reduce material costs compared with a nano-Ag paste. A reliability study of Cu-sintered joints can facilitate large-scale applications in the electric vehicle industry as only a few systematic studies have investigated the thermal shock reliability of low-cost Cu-sintered joints. To evaluate the thermomechanical stability and bond strength of the Cu?밃g sintered joints, a thermal shock test between ?닋혻40 and 150혻°C for 1000 cycles and die shear tests, respectively, were performed. The thermal shock test results clearly demonstrated that the micro?뱊ano bimodal Cu?밃g sintered joints maintained a high strength (60혻MPa) for 1000 cycles. The bimodal Cu?밃g paste die-attach is reliable because of stable microstructures that are free of cracks and interfacial debonding. The results showed that our bimodal Cu?밃g paste die-attach can be used in both Si and SiC power devices operating at high temperatures.
KSP Keywords
Ag paste, Cu-Ag, Die-Attach, High Temperature, High-strength, Interfacial debonding, Large-scale applications, Low-cost, Micro-nano, Shear tests, SiC power devices