상세정보
학술지
Thermal shock reliability of micro-nano bimodal Cu-Ag sintered joints
- 발행일
- 202208
- 출처
- Journal of Materials Science : Materials in Electronics, v.33, pp.17493-17501
- ISSN
- 0957-4522
- 출판사
- Springer
- 협약과제
- 21IU1200, 국방 무기체계용 핵심 반도체 부품 자립화 플랫폼 개발, 임종원
- 초록
- In this study, we investigated the thermal shock reliability of die-attach technology using a micro?뱊ano bimodal Cu?밃g paste, which can considerably reduce material costs compared with a nano-Ag paste. A reliability study of Cu-sintered joints can facilitate large-scale applications in the electric vehicle industry as only a few systematic studies have investigated the thermal shock reliability of low-cost Cu-sintered joints. To evaluate the thermomechanical stability and bond strength of the Cu?밃g sintered joints, a thermal shock test between ?닋혻40 and 150혻°C for 1000 cycles and die shear tests, respectively, were performed. The thermal shock test results clearly demonstrated that the micro?뱊ano bimodal Cu?밃g sintered joints maintained a high strength (60혻MPa) for 1000 cycles. The bimodal Cu?밃g paste die-attach is reliable because of stable microstructures that are free of cracks and interfacial debonding. The results showed that our bimodal Cu?밃g paste die-attach can be used in both Si and SiC power devices operating at high temperatures.
- KSP 제안 키워드
- Ag paste, Cu-Ag, Die-Attach, High Temperature, High-strength, Interfacial debonding, Large-scale applications, Low-cost, Micro-nano, Shear tests, SiC power devices