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학술지 Thermally stable and soft pressure-sensitive adhesive for foldable electronics
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조우성, 정기훈, 박영삼, 이정익, 임성갑, 김택수
Chemical Engineering Journal, v.452 no.1, pp.1-8
19PB4500, 플랙서블 전자소재 산업기술 기반 조성, 박종문
Soft pressure-sensitive adhesives (PSAs) are widely adopted in foldable electronics to integrate devices and to form multiple neutral planes (MNPs), that protect brittle films in the devices during folding. The mechanical properties and reliability of PSAs at the operating temperature of foldable devices are key factors for their practical application. Herein, we synthesize a thermally stable, yet soft PSA via initiated chemical vapor deposition (iCVD). The molecular network of the soft PSA is composed of a copolymer film of 2-ethylhexyl acrylate (EHA) and 2-hydroxyethylacrylate (HEA) monomers, whose composition is controlled systematically by tuning the input flow rate of each monomer during iCVD. As a result, the storage modulus of the synthesized PSA is lower than 1 MPa from ?닋35 to 85 ?꼦 without any flow. The hard-coated laminate integrated by the synthesized PSA can be protected during bending at ?닋35 ?꼦 by the MNPs, as the inserted PSA is still soft at such a low temperature. Moreover, the shear strength of the synthesized PSA does not degrade even after exposure to temperatures of ?닋40 ?꼦 and 85?꼦 for 7 days. The extraordinary mechanical reliability and the durability against delamination is further confirmed through a folding fatigue test and a static folding test (holding fold state) under various operating temperatures (-40 ?꼦, 25 ?꼦, and 85 ?꼦).
Delamination, Foldable electronics, Initiated chemical vapor deposition (iCVD), Multiple neutral planes, Pressure sensitive adhesive (PSA), Thermal stability
KSP 제안 키워드
2-Hydroxyethylacrylate, 2-ethylhexyl acrylate(EHA), Copolymer films, Fatigue test, Flow rate, Initiated Chemical Vapor Deposition, Key factor, Low temperature(LT), Mechanical properties(PMCs), Molecular network, Pressure-sensitive adhesive