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Conference Paper
Interconnection Reliability of Mini LEDs for Display Applications
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- Authors
- In-Seok Kye, Jiho Joo, Gwang-Mun Choi, Chanmi Lee, Ki-Seok Jang, Yong-Sung Eom, Kwang-Seong Choi, Yong-Jun Oh
- Issue Date
- 2022-06
- Citation
- Electronic Components and Technology Conference (ECTC) 2022, pp.1184-20
- Publisher
- IEEE
- Language
- English
- Type
- Conference Paper
- Abstract
- Micro/Mini-LED displays have many advantages compared to other displays. However, the reliability data required for the commercialization of mini-LEDs is insufficient. In this study, we analyzed the reliability of mini-LEDs by comparing the shear strength and microstructure of their solder joints before and after conducting a reliability test. We first performed a simultaneous transfer and bonding (SITRAB) process to mount mini-LEDs on a substrate. To analyze the effect of underfill on mini-LED reliability, we compared those both with and without SITRAB adhesive. The mini-LED with SITRAB adhesive showed a small decrease in shear strength after the reliability test, whereas the mini-LED without SITRAB adhesive showed a large decrease in shear strength after the reliability test. As a result of measuring the optical characteristics of the LED after the reliability test, it was observed that there was no change in the characteristics of the mini-LED. It can be concluded that the SITRAB process with SITRAB adhesive improved the reliability of mini-LEDs.
- KSP Keywords
- Display applications, LED display, LED reliability, Optical characteristics, Shear strength, Solder joint, Strength and microstructure, reliability test