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Detail
Journal Article
마이크로 LED 전사, 접합, 그리고 불량 화소 수리 기술
- Issue Date
- 2022-04
- Citation
- 전자통신동향분석, v.37, no.2, pp.53-61
- ISSN
- 1225-6455
- Publisher
- 한국전자통신연구원
- Language
- Korean
- Type
- Journal Article
- Abstract
- MicroLEDs have various advantages and application areas and are in the spotlight as next-generation displays. Nevertheless, the commercialization of microLEDs is slow because of high cost as well as difficulties in the transfer, bonding, and bad pixel repairing process. In this study, we review the development trends of transfer, bonding, and defective pixel repair technologies, which are critical for microLED commercialization, focusing on materials that determine these technologies. In addition, we focus on the simultaneous transfer bonding technology developed by the Electronics and Telecommunications Research Institute, which has been attracting enormous research attention recently.
- KSP Keywords
- Application areas, Bad pixel, Bonding technology, Development trends, Next-generation, Repair technologies, Research institute
This work is distributed under the term of Korea Open Government License (KOGL)
(Type 4: : Type 1 + Commercial Use Prohibition+Change Prohibition)
(Type 4: : Type 1 + Commercial Use Prohibition+Change Prohibition)
