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Conference Paper
Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
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- Authors
- Ki-Seok Jang, Yong-Sung Eom, Gwang-Mun Choi, Kook-Man Kim, Jeong-Soo Lee, Kwang-Seong Choi
- Issue Date
- 2022-09
- Citation
- Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30
- Publisher
- IEEE
- Language
- English
- Type
- Conference Paper
- Abstract
- Polyethylene Terephthalate (PET) is an excellent material for transparent display products that are flexible, easy to process and low cost. However, conventional flip chip bonding processes using thermo compression (TC) is limited to warpage due to high shrinkage of PET materials. Laser Assisted Bonding (LAB) technology can be an excellent solution to this warpage of PET by controlling temperature and time during the flip chip bonding process. In this study, an epoxy-based solder paste (named Hybrid Underfill) was developed to integrate LED devices into flexible substrates.
- KSP Keywords
- Bonding process, Epoxy-based, Flexible substrate, Flip-chip bonding, LED devices, Laser-assisted, Low-cost, Polyethylene terephthalate, Solder paste, Transparent display