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학술대회
Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
- 발행일
- 202209
- 출처
- Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30
- 협약과제
- 22JB1700, 개발도금 소재 활용 HBM2급 적층 칩 접합 기술 및 신뢰성 향상 기술개발, 엄용성
- 초록
- Polyethylene Terephthalate (PET) is an excellent material for transparent display products that are flexible, easy to process and low cost. However, conventional flip chip bonding processes using thermo compression (TC) is limited to warpage due to high shrinkage of PET materials. Laser Assisted Bonding (LAB) technology can be an excellent solution to this warpage of PET by controlling temperature and time during the flip chip bonding process. In this study, an epoxy-based solder paste (named Hybrid Underfill) was developed to integrate LED devices into flexible substrates.
- KSP 제안 키워드
- Bonding process, Epoxy-based, Flexible substrate, Flip-chip bonding, LED devices, Laser-assisted, Low-cost, Polyethylene terephthalate, Solder paste, Transparent display