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학술대회 Low Height Wire bond Looping Technology Using Wedge Bonding for the MMIC Package
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박아영, 이재학, 김승만, 강수민, 한성흠, 김성일, 송준엽
Electronic System-Integration Technology Conference (ESTC) 2022, pp.169-174
21IU1200, 국방 무기체계용 핵심 반도체 부품 자립화 플랫폼 개발, 임종원
As the package integration density increases, the demand for reducing the bond wire length and lowering the wire loop height is constantly increasing. As the wire loop height decreases, the wire's stiffness increases, minimizing wire collapse during the molding process and preventing damage due to the exposed wire beyond the molding during the marking process. At the same time, the shorter length of the wire reduces the inductance and resistance of the interconnection, thereby improving electrical characteristics during high-power signal transmission. Various studies have been performed on the wire low loop profiles, but most of them are for ball bonding which is the dominant process for wire bonding. There are no studies on loop formation, loop profile according to bonding process parameters, and corresponding loop height formed by wedge bonding. Therefore, in this study, a method of forming an ultra-low loop using a 1 mm thick gold wire by comparing and analyzing loop formation was proposed. In addition, the characteristics of the loop height based on a parametric study of the wedge bonding process were analyzed for the application of a highly integrated package or high-power package.
KSP 제안 키워드
Ball bonding, Bond wire, Bonding process, Gold wire, High power, Loop formation, Loop profile, Molding process, Parametric study, Power Signal, Process Parameters