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Conference Paper 패키지 방열 설계를 위한 열-전기 해석의 Co-Simulation
Cited - time in scopus Share share facebook twitter linkedin kakaostory
Authors
Bongmin Jeong, Aesun Oh, Gawon Lee, Hyuncheol Bae
Issue Date
2023-02
Citation
한국반도체 학술대회 (KCS) 2023, pp.1-1
Language
Korean
Type
Conference Paper
KSP Keywords
Co-simulation
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