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Conference Paper
Chiplet Heterogeneous-Integration AI Processor
- Authors
- Youngsu Kwon, Jinho Han, Yongcheol Peter Cho, Juyeob Kim, Jaehoon Chung, Jaewoong Choi, Sujin Park, Igyeong Kim, Hyunjeong kwon, Jinkyu Kim, Hyunmi Kim, Won Jeon, Youngdeuk Jeon, Minhyung Cho, Minseok Choi
- Issue Date
- 2023-02
- Citation
- International Conference on Electronics, Information and Communication (ICEIC) 2023, pp.1-2
- Language
- English
- Type
- Conference Paper
- Project Code
- 22JS1700, PIM 2.5D Large-Scale Super-Performance Interposer and 3D Hybrid Bonding Platform for PIM Seimconductor integrating Processors and High-Bandwidth Memor, Kwon Young-Su