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Journal Article
Light field microscope target with low power, low pressure reactive ion etching process
- Authors
- Chihoon Kim, Sang Yun Kim, Munseob Lee
- Issue Date
- 2023-06
- Citation
- Current Applied Physics, v.50, pp.127-132
- ISSN
- 1567-1739
- Publisher
- Elsevier BV
- Language
- English
- Type
- Journal Article
- Abstract
- This study relates to the manufacturing process of 3-dimensional resolution target for light field microscope that can obtain 3-dimensional image information. Based on the optical specifications of the micro-lens array, 3-dimensional resolution target was designed to simultaneously measure resolution of lateral, axial and field of view. The width of each block gradually decreases from 24 μm, and 5 μm is the minimum width. These blocks are arranged in a square shape of 0.46 × 0.46 mm2. We also fabricated 3-dimensional resolution target based on reactive ion etching process with photolithography to produce silicon microstructure. To remove the recessed shape of the silicon etched corners and stepping of the sidewalls, we combined CF4 (66%), SF6 (16%) and O2 (16%) gases while maintaining low power (30 Watt) and pressure (15 mTorr) to obtain a smooth surface and distinct anisotropic etch characteristics. The fabricated samples showed uniform surface and height characteristics. Based on manufactured 3-dimensional target, a 3-dimensional perspective view image was shown using a light field microscope.
- KSP Keywords
- 3-dimensional, Anisotropic etch, Etch characteristics, Field microscope, Field of View(FoV), Image information, Light Field, Low pressure, Manufacturing processes, Microlens array, Minimum width
This work is distributed under the term of Creative Commons License (CCL)
(CC BY)
(CC BY)
